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| AMERICAN BRIGHT OPTOELECTRONICS CORP. * Gap DOMILED BL-PDP-GJS Series Feature: 1. Surface mount LED. 2. 120 viewing angle. 3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm. 4. Qualified according to JEDEC moisture sensitivity Level 2. 5. Compatible to both IR reflow soldering and TTW soldering. * Package Dimension: Recommended Solder Pad V.2 Page: 1 of 5 AMERICAN BRIGHT OPTOELECTRONICS CORP. * Gap DOMILED BL-PDP-GJS Series Optical Characteristics: Part Number BL-PDP-GJS-C10 * * * BIN G1 BIN G2 BIN H1 BIN H2 Chip Technology / Color GaP / Green, 560 nm Luminous Intensity @ If = 10mA Iv ( mcd ) 1.80 ... 4.50 1.80 ... 2.24 2.24 ... 2.80 2.80 ... 3.55 3.55 ... 4.50 * Forward voltage @ If=10 mA. 2.05 V (typ.); 2.45 V (max) NOTE: Chip Type GaP Viewing angle at 50% Iv 120 Reverse current, IR @ VR = 5V, (max) 100 A 1. Other luminous intensity groups are also available upon request. 2. Luminous intensity is measured with an accuracy of 11%. 3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. 4. An optional Vf binning is also available upon request. Binning scheme is as per following table. * Absolute Maximum Ratings: Maximum Value DC forward current. Peak pulse current; (tp 10 s, Duty cycle = 0.005) Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. Power dissipation ( at room temperature ) 30 500 5 100 -40 ... +100 -40 ... +100 75 Unit mA mA V C C C mW * Vf Binning: Vf Bin @ 10mA 01 02 03 04 Forward voltage (V) 1.25 ... 1.55 1.55 ... 1.85 1.85 ... 2.15 2.15 ... 2.45 V.2 Page: 2 of 5 AMERICAN BRIGHT OPTOELECTRONICS CORP. * Gap DOMILED BL-PDP-GJS Series Wavelength Grouping: Color BL-PDP; Pure Green Group Full W X Y Z Wavelength distribution (nm) 552.5 - 564.5 552.5 - 555.5 555.5 - 558.5 558.5 - 561.5 561.5 - 564.5 Wavelength is measured with an accuracy of 1 nm. * Relative intensity. Normalized at 10 mA. Typical electro-optical characteristics curves: Fig. 2 Forward current vs. forward voltage. Forward Current vs. Forward Voltage 35 Fig. 1 Relative luminous intensity vs. forward current. Intensity vs. DC Forw ard Current 4.0 Forward Current (mA) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 30 35 FORW ARD CURRENT (m A) 30 25 20 15 10 5 0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Forward Voltage (V) Fig. 3 Radiation pattern 30 20 10 0 1.0 Fig. 4 Maximum forward current vs. temperature 35 30 40 0.8 25 Forward Current, If 50 0.6 20 15 60 70 80 90 0.4 10 0.2 5 0 0 10 20 30 40 50 60 70 80 90 100 Ambient Temperature 0 V.2 Page: 3 of 5 AMERICAN BRIGHT OPTOELECTRONICS CORP. Gap DOMILED BL-PDP-GJS Series Fig. 5 Recommended IR-reflow Soldering Profile (acc. to IPC 9501) Classification Reflow Profile (JEDEC J-STD-020B) 275 250 225 Ramp-up 3 oC/sec 60-150s 235-240oC 10-30s Temperature ( C) 200 175 150 125 100 75 50 o 183 oC Ramp-down 6 oC/sec Preheat 60-120s 360s max 25 0 50 100 150 200 Time (sec) Fig. 6 Recommended TTW Soldering Profile (acc. to CECC 00802). V.2 Page: 4 of 5 AMERICAN BRIGHT OPTOELECTRONICS CORP. Gap DOMILED BL-PDP-GJS Series * Taping And Orientation. Reels come in quantity of 2000 units. Reel diameters is 180 mm . V.2 Page: 5 of 5 |
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